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AiXun 50g Solder Paste For CPU Upper PCB Micorsoldering Mobile Repair Motherboard Dedicated Ball Planting 138 183 158 Tin Paste

AiXun 50g Solder Paste For CPU Upper PCB Micorsoldering Mobile Repair Motherboard Dedicated Ball Planting 138 183 158 Tin Paste

$3.59
$3.99 $3.59
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Option: Nano-Tin Paste

Description:

AiXun lead free solder paste has different types in melting points so as to satisfy various soldering needs. The SP-138 degree low temperature paste is a special solder consumable that can be applied to iPhone X/XS/XSMAX middle frame and mainboard tin planting, the lead-free and silver containing formula is benefit for environmental protection. The tin balls it creates are delicate, round and full. It has a good viscosity, no blistering and even no solder bead. The SP-183 degree medium temperature nano flux paste is more suitable for welding and maintenance of after-sales mobile phone motherboard, nano chip, BGA, SMT reballing. It has a strong tin climbing ability, good conductivity and strong tin load capacity, which enables no rework after planting balls.

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Tiempo de envío

After purchasing the goods, we will start shipping in 3-5 days and arrive at the airport in about 3 days. The shipping time to the United States is generally 5-12 days (the time from starting shipping to receiving the package), and the shipping time to Europe and other regions It’s 10-20 days

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We will use yellow packaging bags and wrap them with transparent tape to prevent water from entering the package and to prevent the wrapping paper from breaking.

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